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Full Automatic LED Solder Outer Layer Exposure System

Import the top core LED chip
Speeding high precision, quality and stability
Completely solve the problem of film consumption
Significantly reduce production costs

Product Details

Application Scope

1

Dimension of Circuit Board

Max:650mm×580mm     Min:300mm×300mm

2

Thickness of Circuit Board

0.1mm-4.0mm

3

Dimension of Negative Film

700mmx610mm

4

Line Resolution

50μm(2.0Mil)

Light Source System

5

Type of Light Source

LED parallel light source

6

Light Source Test

KST patent UV LED mentor system

7

Collimation Half Angle

≤2°

8

Energy Uniformity

>85%

9

Cooling Mode

lce-water cooling

Working Table

10

Exposure Mode

Single-side exposure

11

Exposure Area

645mmx575mm

Program System

12

Program System

PC+PLC

Alignment System

13

Optical alignment and inspection time.

4CCD/2-2.5seconds

14

Precision of alignment

8μm

15

Aligntment Image Detection

Automatic move the circuit board to align

16

Negative Film Fixing Mode

Vacuum adsorption

Cycle time

17

Mechincal

10seconds

18

Environment Temperature

Depends on exposure energy needed

Demands

on Environmen

19

Environment Temperature

22℃±2℃with constant temperature and humidity system

20

Environment Humidity

55%±5% with constant temperature and humidity system

21

Clean Degree

Class 10000

External Facilities

22

Air Pressure

5.5kg/cm2

23

Ice Water

16-18℃

24

Power Supply

Three-phase Five-wire 380V AC/50Hz/30KVA

Dimension/Weight

25

Dimension

5980mm(L)×1780(W)×2400(H)

26

Weight

3800Kg

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